BASF’s Ultramid® T7000 Bridges the Gap Between PA66 and PPA

December 1, 2024 – BASF has unveiled a groundbreaking PA/PPA blend, Ultramid® T7000, designed to bridge the market gap between PA66 and PPA, specifically tailored for replacing metal structural components. This innovative material, according to industry sources, boasts exceptional mechanical properties, outstanding dimensional stability, ease of injection molding, and a smooth surface finish, making it…

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New PPA Material from BASF Meets Demanding IGBT Requirements

November 14, 2024 – BASF has recently unveiled an innovative polyphthalamide (PPA) material, Ultramid Advanced N3U41 G6, specifically engineered for the production of Insulated Gate Bipolar Transistor (IGBT) semiconductor housings. In response to the growing demand for high-performance, reliable electronic components in electric vehicles, high-speed trains, smart manufacturing, and renewable energy generation, this new material…

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